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3onedata AVAILABILITY AT RFQ

IEM618-4D-2C

IEM618-4D-2C

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The 3onedata IEM618-4D-2C is an embedded managed switch module with eight configurable 100M fiber/copper ports, four full-signal TTL serial ports, and two TTL-level CAN ports. Its official datasheet lists 300–115200 bps serial baud, 5–1000 Kbps CAN baud, 3.3 VDC ±5% input, power consumption below 1.5 W, 2 Gbit/s backplane bandwidth, and -40 to +85 °C operation. Carrier-board integration remains subject to engineering review.

Application evidence

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Specifications

IEM618-4D-2C specifications
Key specifications
ModelIEM618-4D-2C
Ethernet Ports8 × 100M, configurable as 10/100Base-T(X) or 100Base-FX
Serial Ports4 × full-signal TTL-level ports; RS-232/RS-485/RS-422 optional
Serial Baud Rate300–115200 bps
Serial Format5/6/7/8 data bits; None/Even/Odd/Space/Mark parity; 1/1.5/2 stop bits
Can Ports2 × TTL-level CAN
Can Baud Rate5–1000 Kbps
ManagementCLI, Web, Telnet, SNMP v1/v2c
RedundancySW-Ring, STP/RSTP
Published Ring Recoveryless than 20 ms
Mac Table2K
Packet Buffer1 Mbit
Backplane Bandwidth2 Gbit/s
Switch Latencyless than 10 μs
Power Input3.3 VDC ±5%
Power Consumptionless than 1.5 W
Operating Temperature-40 to +85 °C
Storage Temperature-40 to +85 °C
Humidity5%–95% RH, non-condensing
Mountingembedded, heat-conducting fin; heatsink optional
Dimensions72 × 9.5 × 54 mm
CertificationsCE, FCC, RoHS
Warranty5 years
Commercial
Model numberIEM618-4D-2C
Brand3onedata
CategoryIndustrial Gateways
CertificationCE · FCC · RoHS
AvailabilityConfirm availability at RFQ
Key specifications
ModelIEM618-4D-2C
Ethernet Ports8 × 100M, configurable as 10/100Base-T(X) or 100Base-FX
Serial Ports4 × full-signal TTL-level ports; RS-232/RS-485/RS-422 optional
Serial Baud Rate300–115200 bps
Serial Format5/6/7/8 data bits; None/Even/Odd/Space/Mark parity; 1/1.5/2 stop bits
Can Ports2 × TTL-level CAN
Can Baud Rate5–1000 Kbps
ManagementCLI, Web, Telnet, SNMP v1/v2c
RedundancySW-Ring, STP/RSTP
Published Ring Recoveryless than 20 ms
Mac Table2K
Packet Buffer1 Mbit
Backplane Bandwidth2 Gbit/s
Switch Latencyless than 10 μs
Power Input3.3 VDC ±5%
Power Consumptionless than 1.5 W
Operating Temperature-40 to +85 °C
Storage Temperature-40 to +85 °C
Humidity5%–95% RH, non-condensing
Mountingembedded, heat-conducting fin; heatsink optional
Dimensions72 × 9.5 × 54 mm
CertificationsCE, FCC, RoHS
Warranty5 years
Commercial
Model numberIEM618-4D-2C
Brand3onedata
CategoryIndustrial Gateways
CertificationCE · FCC · RoHS
AvailabilityConfirm availability at RFQ

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Engineering notes

For the IEM618-4D-2C, engineering review covers physical ports, network topology and ring behavior, protocol-bridge mappings, data model, timing, and the required management layer. Any cross-brand proposal is a candidate replacement — subject to engineering review.

  • The Ethernet, serial and CAN interfaces are module-level signals whose final connector and transceiver implementation depends on the carrier board
  • RS-232, RS-485 and RS-422 are listed as serial-interface options, not simultaneous modes on every port
  • Pin mapping, thermal design, signal levels, isolation and enclosure protection remain subject to engineering review
  • Availability and lead time are confirmed at RFQ

Frequently asked

Which Ethernet, serial, and CAN interfaces does IEM618-4D-2C provide?

The official datasheet lists eight configurable 100M fiber/copper Ethernet ports, four full-signal TTL serial ports with optional RS-232/RS-485/RS-422 implementation, and two TTL-level CAN ports.

What serial and CAN baud rates does IEM618-4D-2C support?

The datasheet lists 300 to 115200 bps for the serial ports and 5 to 1000 Kbps for the CAN ports.

What power and temperature specifications apply to IEM618-4D-2C?

IEM618-4D-2C uses 3.3 VDC ±5%, consumes less than 1.5 W, and is specified for -40 to +85 °C operating and storage temperatures.

Can IEM618-4D-2C replace another embedded Ethernet switch module?

IEM618-4D-2C may be evaluated as a candidate replacement, subject to engineering review of pinout, carrier-board layout, transceivers, serial and CAN signal levels, thermal design, firmware, and dimensions.

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